IPC-7351C tightens FPC pad tolerance to ±0.05 mm and mandates 3D validation reports. Learn how this update impacts HDI-FPC design, yield control, sourcing, and compliance.

HVLP copper foil lead times stretch to 22 weeks as the flexible circuit supply gap hits 63%. Learn how FCCL, FPC, wearable, and Q3 delivery plans may be affected.

HVLP copper foil lead times extend to 22–26 weeks as the FPC supply gap widens. Learn how supplier qualification, LTA-backed sourcing, and certification shifts are reshaping Flexible Circuits procurement.

HVLP copper foil lead times stretch to 32 weeks as the Flexible Circuit material gap widens to 63%. See what FPC buyers, traders, and sourcing teams should monitor now.

Vietnam Requires Reflow Trace Codes From July 1: learn how the new Vietnam customs rule affects SMT, PCB assemblies, EMS exports, and shipment compliance before delays disrupt delivery.

Flexible Circuits face rising pressure as PI fabric costs surge 47%, tightening process margins, lowering fine-line yield, and extending prototype timelines for medical and wearable projects.

E-Glass fabric spike adds pressure to flexible circuits as FCCL costs rise and FPC quotes climb 12%–18%. See what it means for pricing, margins, and production control now.

Flexible circuits delivery delays loom as WTO cuts 2026 global trade growth to 1.9%—discover urgent mitigation strategies for exporters, CMOs & supply chain teams.