IPC-7351C tightens FPC pad tolerance to ±0.05 mm and mandates 3D validation reports. Learn how this update impacts HDI-FPC design, yield control, sourcing, and compliance.

HVLP copper foil lead times stretch to 22 weeks as the flexible circuit supply gap hits 63%. Learn how FCCL, FPC, wearable, and Q3 delivery plans may be affected.

HVLP copper foil lead times extend to 22–26 weeks as the FPC supply gap widens. Learn how supplier qualification, LTA-backed sourcing, and certification shifts are reshaping Flexible Circuits procurement.

HVLP copper foil lead times stretch to 32 weeks as the Flexible Circuit material gap widens to 63%. See what FPC buyers, traders, and sourcing teams should monitor now.

HVLP copper foil lead times stretch to 26 weeks, disrupting flexible circuit supply plans. See what it means for procurement, production risk, and global delivery strategy.

Shenzhen Flexible Electronics Show highlights a faster PI film shift: lower costs, 89.3% Flexible Circuits yield, and 14-day delivery trends reshaping sourcing, compliance, and supplier strategy.

Flexible Circuit lead times stretch to 18 weeks after the SKC PI film disruption, putting NPI, dual-source certification, and delivery plans at risk. See what buyers and manufacturers should do now.

Flexible Circuits face rising pressure as PI fabric costs surge 47%, tightening process margins, lowering fine-line yield, and extending prototype timelines for medical and wearable projects.