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Tagname : substrates

  • Sumitomo Resin Up 10-20%, RF Chains Feel Pressure
  • EU CBAM Tightens LCA Reporting for EMI Shielding Components from May 2026
  • Global Lead Times for Key Semiconductor Equipment Components Extend to 18–24 Months
  • EU Updates RoHS Exemptions: Metal-Core PCBs and Heat Dissipation Modules Require Compliance Reassessment
  • Semiconductor Manufacturing Trends to Watch in 2026
    Semiconductor Manufacturing Trends to Watch in 2026
  • EU REACH Adds New Restricted Substances: SVHC Compliance Updates Required for Precision Capacitors and EMI Shielding Coatings
  • U.S. Cuts Section 232 Tariffs on Metal-Intensive Components, Boosting Exports of MCPCBs and SMT Thermal Solutions
  • New U.S. Tariffs on Chinese Aluminum, Copper Products Take Effect May 2026
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Thermal & Enclosure

  • Potting Compounds

  • Heat Dissipation

  • EMI Shielding

Passive & Electromech

  • Connectors

  • Relays

  • Precision Capacitors

Active Components

  • RF Modules

  • Power Semi

  • MCU & Chipsets

SMT & Assembly

  • AOI Testing

  • Reflow Soldering

  • Pick & Place Specs

PCB & Substrates

  • Metal Core PCB

  • Flexible Circuits

  • HDI Technology

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