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Tagname : wireless communication modules

  • UL 62368-3:2026 Takes Effect for RF Module Burn Testing
    UL 62368-3:2026 takes effect for RF module burn testing, introducing a 10 mm, 3.5°C limit that impacts UL listing and OEM acceptance. Learn the compliance risks and next steps.
  • Japan Tightens RF Module Shielding Standard
    Japan Tightens RF Module Shielding Standard: learn how JIS C 5012:2026 raises SE thresholds, adds 10–40 GHz scans, and impacts PSE approval for Japan-bound RF products.

    Thermal & Enclosure

    • Potting Compounds

    • Heat Dissipation

    • EMI Shielding

    Passive & Electromech

    • Connectors

    • Relays

    • Precision Capacitors

    Active Components

    • RF Modules

    • Power Semi

    • MCU & Chipsets

    SMT & Assembly

    • AOI Testing

    • Reflow Soldering

    • Pick & Place Specs

    PCB & Substrates

    • Metal Core PCB

    • Flexible Circuits

    • HDI Technology

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